Analysis

Nordson DAGE’s Senior Applications Engineer to Present at SMART Group BGA and Cleaning Reliability Conference

3rd October 2011
ES Admin
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference, scheduled to take place October 5-6, 2011 at the Oxfordshire Conference Centre in Thame, Oxfordshire.
Pad cratering is one of the dominant failure modes occurring in various board-level reliability tests, especially under dynamic loading. In recent years, the increasing propensity of pad cratering due to the implementation of lead-free technology calls for reassessment of printed circuit board (PCB) qualification and understanding of the mechanism of pad cratering. Test methods to quantify pad cratering as well fatigue life testing will be explored in the presentation.

Kamran Iqbal is the Senior Applications Engineer for Nordson DAGE, specializing in new application development for bond test equipment platforms and materials testing. Prior to this role, Kamran has worked in the automotive research and development field, and in the electronic design, test and inspection areas, primarily in the defense and aviation industry. Kamran holds a Bachelor’s Degree in Electronic and Electrical Engineering and a Master’s Degree in Wireless Engineering from UK universities, and is experienced in electromechanical engineering.

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