The intermetallic compound Cu6Sn5 is a key constituent of solder joints on copper substrates and this paper, coauthored with Nihon Superior President Tetsuro Nishimura and University of Queensland’s Associate Professor Kazuhiro Nogita, will report the results of a study on the kinetics of the transformation of this compound from the hexagonal to the monoclinic form. The volume change associated with this transformation could significantly impact solder joint reliability. The work reported was undertaken as part of a research project at the University of Queensland that was funded by Nihon Superior Co. Ltd.
Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium
Nihon Superior Co. Ltd. announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The presentation will take place during Session TA1, titled “PB-Free Advancements” on Tuesday, February 14 at 9:30 a.m.