NEC to Begin 40nm Manufacturing

NEC Yamagata began sample shipment of 55-nanometer devices in October 2007, and volume production of 40-nanometer devices is scheduled to begin by the end of the next fiscal year. The first products to be manufactured using the new 40-nanometer technology are expected to be advanced system LSI chips and ASICs with embedded memory (eDRAM) for consumer electronics, mobile handsets, and game consoles.

As consumers demand smaller form factors and longer operating times for mobile applications and other electronics, semiconductor companies must deliver devices with higher performance, smaller footprints, lower power consumption features, and lower costs. To achieve these goals, the implementation of advanced process technologies is vital.

Since the launch of 300-millimeter wafer production at NEC Yamagata in January 2005, NEC Electronics has invested 140 billion yen to date for 130-nanometer, 90-nanometer, and 55-nanometer manufacturing at the site. The company has also introduced the use of several low power technologies, such as high-k metal gate stacks, which have helped achieve significant reductions in power consumption and earned high marks from customers.

The additional 10 billion yen investment this fiscal year to upgrade NEC Yamagata's 300mm line will allow production of up to 5,000 wafers per month using 55-nanometer technology, of which approximately 2,000 wafers per month can be adapted for 40-nanometer technology. NEC Yamagata’s total manufacturing capacity, which currently stands at approximately 13,000 wafers per month, will remain unchanged, and the facility will continue to support 130-nanometer and 90-nanometer production.