The test socket portfolio covers the widest scope of applications for the full temperature range from -60° to 200°C:
• Bandwidth up to 40 GHz
• High power/high current up to 1,000 A
• KELVIN Contactors
The portfolio is based on Multitest’s advanced Cantilever Technology and the proprietary Quad Tech™ concept, and includes contacting solutions for:
• All handler types and brands
• Leaded and lead-free package
• Array and inline package
• Small-pitch devices down to 0.25 mm
• Singulated test, strip test and WLCSP
Multitest also will highlight its ATE printed circuit board design, fabrication and assembly resources. State-of-the-art production equipment and Multitest’s long-term experience ensure reliable on-time delivery and industry-leading quality for advanced applications such as 0.4 mm pitch. The company’s well-established production process avoids sequential lamination, even for high-layer count boards.
Additionally, Multitest’s experts will present the following topics at the conference:
• Signal and power integrity in the test interface
• Kelvin contacting – applications and solutions