The theme for this MOST Forum was ‘MOST150 – Next Step: Rollout’. In addition to this applicatory approach to MOST Technology demonstrated by Audi and Daimler, several papers presented research results and visions for possible future scenarios, including gigabit transmission over POF (plastic optical fiber). In his keynote speech, Peter Haeussermann, Head of Telematics Electrics/Electronics at Daimler, attested that MOST150 has successfully passed comprehensive evaluation and is ready for mass production. He concluded with the outlook that Daimler will start MOST150 in Mercedes-Benz S-Class vehicles in 2013.
In the well-attended exhibition area, numerous companies presented their innovative MOST solutions and applications. Amongst the exhibitors was the MOST Cooperation, with a demonstrator showing the seamless integration capabilities of Ethernet based devices with MOST. The central MOST hub device showed how different physical layer and topology options may be used depending on application requirements. Audi, BMW and Daimler brought in some of their latest car models to demonstrate MOST applications, such as rear seat entertainment and Internet access. Avago Technologies, Continental, Elektrobit, GADV, Goepel electronic, Hamamatsu Photonics, K2L, LeCroy, Melexis, Ontorix, Ruetz System Solutions, SMSC, Telemotive, TTTech Automotive, Vector Informatik, and Yazaki also exhibited their latest products and services. Several partners provided their knowledge and expertise to the MOST Forum. These include knowledge partner MOST Cooperation (www.mostcooperation.com), industry partner ZVEI (Electrical and Electronic Manufacturers’ Association, www.zvei.org) and media partners Auto Electronics (www.autoelectronics.com), Automotive Industries (www.ai-online.com), EE Times Europe (www.eetimes.eu), Elektronik automotive (www.elektroniknet.de), and ElektronikPraxis (www.elektronikpraxis.de).