Design kits that encompass IBM’s design rules, process specifications, SPICE parameters and cell libraries are available. The first MPW run based on this technology is provisionally scheduled for the end of August 2007.
Deputy Director of MOSIS, Wes Hansford, commented, “The more advanced the technology, the higher the chance of designs needing at least one re-spin. Costs can escalate out of control if dedicated wafer runs are used at every step. Shared wafer services dramatically reduce risks and cost, while often reducing overall development time too. Companies designing chips can quickly get samples into the hands of their customers while the devices are being fine-tuned for later volume production runs. This flexibility is particularly important in consumer electronics, where product life cycles are continuing to shrink and time-to-market is a critical success factor.”
In Europe, the MOSIS service is exclusively available through EDA Solutions Ltd.