Molex Adds Fully-Automated LED Bonding Capabilities in China

17th March 2009
ES Admin

Molex has increased its manufacturing footprint by adding fully-automated LED bonding capabilities in China. Molex also recently bonded its 500,000,000th LED on a membrane switch using the latest high-speed SMT processes and bonding technology. The company has been applying LEDs to flex circuits for over 20 years through two innovative methods to bond and encapsulate the components for robust electrical and mechanical reliability, providing customers with a low-cost interactive user interface.

“Silver printed circuits on polyester used in membrane switches cannot handle soldering temperatures, so alternative processes must be used,” said Justin Spitzer, business development manager, Molex Incorporated. “Molex began using anisotropically (Z-axis) conductive adhesives and then developed fully conductive epoxy to accommodate our high-speed SMT lines.”

Manufacturers in many industries – including appliance, medical, industrial, consumer, hand-held devices and automotive – can benefit from this technology. Assemblies may also include the bonding of other electronic components, such as resistors, capacitors, seven-segment LEDs and ICs to the thick film circuits, opening the technology to other applications. Integrated components allow customers more flexibility in their membrane switch and user interfaces and can provide a low-cost, robust alternative to PCBs and other discrete lighting components, such as light pipes.

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