MIRTEC Europe’s Groundbreaking 3D AOI Technology to Make UK Debut at NEW 2012

Unquestionably, the inspection industry’s most Technologically Advanced AOI System and winner of the 2011 Global Technology Award, MIRTEC’s all new MV-9 3D Series AOI System is the latest generation MIRTEC in-line platform with 3D capability and can be configured with a state-of-the-art, 15 Mega Pixel top-down camera system. The ground-breaking MV-9 3D technology, which can be found at TestWorks Booth #61 during NEW 2012, features ISIS or Infinitely Scalable Imaging Sensor, a proprietary camera system designed and manufactured by MIRTEC for use with its complete range of inspection equipment. MIRTEC’s innovative ISIS Vision System has been proven to increase throughput by up to 400% thereby maximizing production efficiency and return on investment.

By changing the magnification of the Precision Telecentric Lens the resolution of the optics system may be scaled from 20 microns/pixel with an incredibly large FOV of (77.7mm x 77.7mm) desired for extremely high speed manufacturing; down to 10 microns/pixel with an FOV of approximately (38.8mm x 38.8mm) which is suitable for high end micro-electronics manufacturing. MIRTEC’s revolutionary 3D Multi Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MIRTEC MV-9 machine on display at NEW 2012 will also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

TestWorks will also highlight Mirtec’s industry-leading MV-3L Desktop AOI System complete with Side-Viewer angled camera set. The MIRTEC MV-3L is the industry’s most widely accepted Five Camera Desktop AOI system. This system is configured with a 10 Mega Pixel, Top-Down View Camera with 13.4 micron resolution and four Ten Mega Pixel Side-View Cameras.

The MV-3L also features the Intelli-Beam Laser System. This system provides the “The Third Dimension” in inspection capability — the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

For further information please feel free to stop by Booth #61 to speak with Tim Lyons, Sales Director for TestWorks, at NEW 2012