Analysis

mimoOn presents advanced femtocell technologies at Femtozone Mobile World Congress 2010

3rd February 2010
ES Admin
0
mimoOn, a pioneer in LTE software implementations for programmable radio platforms, announced it will be participating in the Femtozone at Mobile World Congress, Barcelona 15-18 February 2010. The Femtozone (Hall 1, Stand G19) is an area hosted by the Femto Forum, dedicated to featuring the leading companies in femtocell development, and will display the latest in femtocell markets, devices, and technology.
/>
The Femtozone will feature a daily schedule of public presentations from operators and vendors on the major opportunities and challenges facing the femtocell market. mimoOn's VP Standards & IP, Willem Mulder, will be making a presentation entitled LTE self-optimizing networks - The way forward for large-scale cost-effective small cell rollout at 4.30PM on Tuesday, 16 February.

The mimoOn presentation will discuss how LTE's OFDMA-based air interface enables new solutions for interference management and radio resource management, bringing significant improvements in spectrum efficiency.

mimoOn will also be displaying its LTE physical layer, protocol stack layers, and reference designs for femtocells based on flexible and upgradeable software defined radio (SDR) platforms in the product showcase in the Femtozone, and on the mimoOn stand 2B17.

According to Thomas Kaiser, mimoOn CEO, We are noticing a lot of interest from the operator community for deploying LTE femtocells, the reason is that cell capacity can be increased much more dramatically through such a network architecture, than just by changing the radio interface alone. Since mimoOn offers solutions for both infrastructure as well as UEs, the company is in a unique position to offer solutions that incorporate advanced basestation techniques such as interference cancellation and self-organizing algorithms, all at the optimized price points of client-side devices.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier