Motion sensing devices are one of the MEMS industry’s hottest topics, and one reason is increased combo solution adoption. “Yole Développement expects the market for 6 and 9-axis sensors to grow from $598M in 2013 to $2.34B by 2018”, said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies. With this in mind, successful players should take advantage of a technology optimized for cost and size reduction (i.e. with product platforms, new bonding technologies and less-demanding vacuum requirements) while allowing multi-sensor integration.
Last week, Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading
pure-play MEMS foundry, announced the availability of its new MIDIS 200mm MEMS fabrication platform for motion sensing devices. MIDIS™ provides high-volume, low-cost accelerometer and
gyroscope manufacture, or the integration of both into an Inertial Measurement Unit (IMU), thereby addressing the increased demand for inertial sensors in consumer (mobile), automotive and
sports/health applications.
During this webcast, attendees will learn about this 200mm MEMS technology’s key features. Teledyne DALSA will detail how MIDIS™ allows accelerometers, gyroscopes and combo-sensors to be integrated in a very compact, hermetic wafer-level package which can be wire bonded or solder bumped. The company will also highlight how a high vacuum can be maintained in the package cavity, allowing resonator Q factors in excess of 20,000 without the need for expensive getters.
The MIDIS™ platform was successfully deployed to alpha customers and is now being released to a
wider market. This live webcast occurs on June 27 at 8.00 AM PDT. To register, please visit the “Upcoming Webcasts” section of the I-Micronews.com website, or click MIDIS™.
Featured speakers include:
Luc Ouellet, Vice President of Technology Development, Teledyne DALSA Semiconductor
Laurent Robin, Activity Leader, Inertial MEMS Devices & Technology, Yole Développement