Analysis

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011

12th September 2011
ES Admin
Nordson DAGE, a division of Nordson Corporation, will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 9-13, 2011 at the Long Beach Convention Center, Long Beach, CA.
The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

Also featured at the show will be the Nordson DAGE μCT Inspection Option that provides Computerised Tomography functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, submicron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.

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