Kyzen’s Fernando Rueda and Debbie Carboni will present a paper titled “Contamination and its Effect on PCBs”. The presentation will discuss the risks of contamination and its effects on printed wiring assemblies. Increased electrical device functionality is a result of closer spacing between conductors and highly dense interconnects. Electronic assembly reliability decreases with device miniaturization, closer spacing and electric field. Process and service related contaminants accelerate the potential for device failures. Corrosion problems decrease product life and reduce functionality.
Other speakers and topics include:
Jim Timler, STOELTING: Inline Cleaning Technology
Bernie McHugh, NORDSON/ASYMTEK: General Remarks
Winn Cannon, CYTEC: Adhesives
Jerry Donahue, HUMISEAL: Coatings
Rick Zakrajsek, NORDSON: Process Considerations
Fred Verdi, ACI: Tin Whisker Mitigation
A complimentary lunch will be provided at event courtesy of Stoelting and Kyzen.