IPC Conference on Electronics Assembly in Budapest Offers Critical Information for Eastern Europe’s Fast-Growing Industry

“The success of the inaugural conference in 2011 and growing interest among exhibitors and attendees for the 2012 conference reflects the growth of electronics manufacturing services in Eastern Europe,” explains Tony Hilvers, IPC vice president of industry programs. “We are planning a more robust conference in 2012 to accommodate this growth and connect companies in this region.”

Dongkai Shangguan, Ph.D., will deliver the keynote address, “Reliability Issues for Advanced Electronic Products,” on 21 March at 16:15h, followed by a networking reception. The keynote and reception are free activities and will be open to the public.

This year’s technical conference will be more comprehensive than last year’s, covering a wide range of topics including:

• Issues impacting quality and reliability of an assembled board
• Best PCB surface finishes and common failure modes during assembly and operation
• Low melting point lead-free soldering materials
• Reliability of fluxes used in soldering processes
• New stencil technology
• Cleaning for no-clean electronic assemblies
• New board repair methods
• 3D AOI technology
• Reducing costs of failure analysis

Preceding the conference, half-day workshops will be held on 20 March by electronics manufacturing experts Bob Willis and Lars Wallin. Workshop topics include the use of IPC standards in perfecting solder joints, cleaning printed circuit assemblies, practical failure analysis and technical and economic considerations for flex and flex rigid boards.

Suppliers can gain new visibility in the Eastern European market by signing up for tabletop exhibit space, which includes a gold or silver sponsorship, one complimentary registration and promotional opportunities. Gold sponsorships are sold out but silver sponsorships are still available.