Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A up to 150A, voltage class: 600V and 1200V) in the Smart-1,-2 and -3 housings of Infineon. As the creator of the new SmartPACK/PIM module concept, Infineon will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.
Users of SmartPACK/-PIM will now benefit from the new cooperation of two worldwide leading IGBT module manufactures.