Highly adaptable board level shielding

Each can is made from a single piece of un-plated Nickel Silver alloy, with a simple five-sided shape. These cost-effective items are easy for engineers to fit onto a board, with the use of Harwin’s SMT shield can clips. Secondary soldering operations are eliminated, as these clips are soldered at the same time as the rest of the items populating the PCB. The risk of damaging sensitive circuitry through exposure to extreme heat during hand soldering is avoided.

The removable cans also provide easy access to the devices and circuitry underneath, when rework, maintenance or component replacement is necessary, cans can simply be unplugged and re-inserted as required. Inconvenient de-soldering and solder clean-up is all removed from the rework process required by other EMC can styles.

With the new additions, the Harwin EMI/RFI shielding range covers ten millimetre square to 50x25mm sizes, with heights from 2.5 to 5mm and material thicknesses of 0.15 to 0.30mm. Ready-made, these products are all available in volume directly from stock.

“Tackling electromagnetic emissions is a vital aspect of modern electronic designs, particularly for those involved in wireless communication,” said Neil Moore, Product Manager for EMC & Industrial Products at Harwin. “The simple shielding cans and clips from Harwin have gained widespread popularity with electronics engineers. Now we are delivering a wider choice, aimed at helping with EMC requirements in the smallest handheld and wireless applications.”