At this year’s show the company will display an OptiCon AdvancedLine AOI system, featuring angled-view camera (Chameleon), telecentric lens, colour code inspection, and much more, as well as an OptiCon X-Line system, a true 3-D X-Ray inspection system utilizing a unique detection approach that allows for high-speed inline inspection.
GOEPEL electronic will also introduce OptiCon THT-Line, a new THT focused AOI system allowing the inspection of through-hole-parts for properties such as height (up to 80mm), polarity markings, solder joints, and more.
Winner of the 2012 T&MW Best in Test Award in the “Design for Test / Boundary Scan” category, GOEPEL electronic will also be exhibiting and have demos available for its comprehensive, award-winning line of JTAG/Boundary Scan hardware and software for a wide range of test applications perfectly suitable for dense and complex PCBAs, including connectivity tests, embedded instrument access, and in-system programming and processor emulation.
“Void Detection in Large Solder Joints of Integrated Power Electronics” is the topic of GOEPEL electronics’ contribution to this year’s poster session and conference program at IPC APEX.