Enpirion Showcases Power System-on-Chip Solutions at embedded world 2012

Enpirion power experts will be available at the embedded world booth to discuss how their turnkey solutions address specific embedded and industrial hardware engineering challenges and design complexity. Enpirion will display a range of real-world customer designs from leading European and Asian manufacturers that solve these issues.

Enpirion will also showcase its latest high-density PowerSoC family under microscopes to display the inner workings of Enpirion’s technology, including miniaturized inductors, high-frequency FETs and next-generation packaging methodologies.

The extensive Enpirion power system-on-chip (PowerSoC) portfolio provides benefits in industrial embedded applications that include:

- Highest power density = Increased compute and interface resource capacity
- Simplified design flow = Faster time to market, more projects commercialized
- Total solution cost reduction = Competitive products, simplified supply chain
- High efficiency = Reduced energy consumption
- High reliability = Higher-quality end products

“The embedded arena is a very important sector for Enpirion, and our deep, proven expertise in high-frequency semiconductor and magnetics technologies, comprehensive DC-DC system engineering and integrated lead-frame packaging allows us to better serve our embedded customers’ unique design requirements,” said Mark Cieri, Director of Marketing & Business Development, Enpirion. “Visitors to the Enpirion embedded world booth will see for themselves how our PowerSoC solutions optimize power management, without the compromise traditionally expected with discrete products.”