Ohmite Manufacturing Showcases New Electronic Components at Electronica 2012

Ohmite recently expanded its D Series of surface mount device (SMD) heat sinks with two new extrusion forms. Designed to better facilitate pick-and-place equipment, these new forms provide increased options and flexibility. Unlike their predecessor, the Style 10, the Style 20 and Style 30 require no Kapton tape for handling by automatic pick-and-place equipment. Both heat sinks have been designed with a flat zone in the top center, eliminating the need for customers to provide additional supplies.

Also on display, Ohmite’s FC4L Series of four terminal current sense resistors series, which was previously available in five watt package sizes, is now also available in two watt package sizes. Employing a Ni-Cu-Mn resistive element, the FC4L Series features a built in four-terminal design with two larger electrodes for current management and two smaller electrodes for voltage measurement. This Kelvin type resistor is designed for automatic insertion and features a metal foil construction, ensuring a very stable Temperature Coefficient of Resistance (TCR).

The CP4 Series cold plate, four-pass heat sinks are designed for Ohmite heatsinkable type resistors, including the TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. They can also be used to provide maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor devices. Applications include variable speed drives, power supplies, robotics, and motor controls. In addition, the CP4 Series can be used for system prototyping