We are honored to receive this prestigious award, said Mo Ohady, general manager, Digicom Electronics. We owe it to our clients to protect their integrity and brand by mitigating failures that might occur in their products due to contaminated boards. Even with Digicom’s unsurpassed level of board cleanliness, we continue to research and develop new ways to improve our cleaning, as well as all our manufacturing, processes.
Digicom’s cleaning process is repeatable, reliable, and uses an advanced in-line cleaning system to increase speed and throughput. With Digicom’s unique Diamond Track Cleaning Process, products are less susceptible to corrosion-induced failures, thus reducing the need for maintenance or repair. The cost savings to Digicom’s customers, especially those with military, aerospace and medical device applications, are considerable.
The 2012 Global Technology Awards is sponsored by Global SMT & Packaging magazine. A team of international judges selects the best innovations for electronics manufacturing products and services. Entries were judged on innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintainability/repairability.
The award recognizes the best new innovations in the printed circuit assembly and packaging industries. It was presented at the SMTA International Conference in Orlando, FL on October 16, 2012.