Through its participation in the Qseven Consortium, Diamond will develop and deliver off-the-shelf and customized board-level subsystems that integrate Qseven embedded computing cores, Diamond’s industry-leading analog, digital, serial, wireless, and other I/O technologies, and flexible expansion via industry-standard FeaturePak modules. These modular application-ready subsystems will assist OEMs in precisely meeting the budget, energy consumption, and performance requirements of their applications, while shortening time-to-revenue and reducing development costs and risks.
“The Qseven COM (computer-on-module) standard packs the latest low-power, embedded processors, chipsets, and standard system interfaces into a highly compact package while eliminating the need for expensive connectors that unnecessarily burden system costs,” noted Diamond Systems Founder and President Jonathan Miller. “Additionally, Qseven COMs and FeaturePak I/O modules are extremely well suited for deployment together on standard and customized application baseboards.”
“We’re excited to welcome Diamond Systems as the newest Participating Member of the Qseven Consortium,” said Martin Danzer of Qseven Consortium Founding Member company congatec AG. “As the originator of the newly introduced FeaturePak I/O module standard, Diamond has added a significant new companion technology for adding off-the-shelf I/O modules to embedded designs based on Qseven embedded computing cores.”