Daniel LaBouve is VP of Engineering at Innovative Silicon

1st February 2007
ES Admin
Innovative Silicon Inc. (ISi), the developer of Z-RAM high density memory intellectual property, today announced that Daniel LaBouve has joined the company as vice president of engineering. Reporting to ISi CEO, Mark-Eric Jones, LaBouve will be responsible for managing and building the company’s engineering team and driving product development programs.
“Dan is a natural fit to ISi as he brings a wealth of experience in developing world-renowned IP products and building first class engineering organizations,” said Mark-Eric Jones. “He is joining the company at a perfect point in our growth as we have just released Z-RAM Gen2, our ultra dense memory technology that delivers excellent density, power and performance. With Dan’s talent and experience, we are well poised to build upon our existing Z-RAM technology, which is now positioned for broader market adoption.”

LaBouve commented, “ISi is a truly impressive company that has already established the three key ingredients that I look for in a firm… a large addressable market, differentiating intellectual property, and good people. I am really excited to join the company at this point in time and to expand upon the already impressive engineering efforts that have brought the company’s Z-RAM memory technology to its current leadership position.”

LaBouve brings over 20 years of experience to Innovative Silicon. Most recently, he was vice president of engineering for ARM’s Physical IP Division. There, he directed multi-site engineering operations with an annual license revenue of more than $60 million and an organization of approximately 360 engineers. Before this, he was senior director of engineering at Artisan Components where he oversaw standard cell, embedded memory, I/O, silicon technology and validation, and technical publications. He also brings engineering experience from Mentor Graphics, NCR Corporation, and the Delco Electronics Division of General Motors. LaBouve received a bachelor of science degree from the University of California, Santa Barbara. He has also filed a number of patents for the purpose of improving integrated circuit design performance.

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