Miniaturization results in more SMD components on the printed circuit board. This includes more reflow applications. The through-hole components that are still on the assembly may need to be soldered automatically to assure the highest quality. The way to make these connections will depend on the number of joints to be soldered, but for most products, selective soldering will be the best alternative for wave soldering in pallets or hand soldering.
The objectives of this presentation are to demonstrate a reliable selective soldering application and identify differences between alcohol (rosin), low VOC and VOC-free flux systems. Additionally, the presentation will identify the impact of process parameters on the reliability of assemblies.
Statistical analyses using Taguchi as well as Full Factorial Experiments are used to study the impact of the selected process parameters on the surface insulation resistance of the soldered test boards. Thermo-Gravimetric Analysis (TGA) is the method that is used to monitor activity of the flux system during these soldering conditions.
