Nufront Selects CEVA DSP Core for Wireless Baseband Chipsets

The handset industry worldwide continues to standardize around CEVA's DSP cores for wireless processing, so it was a natural choice for us to license their DSP technology for our wireless chipsets, said Rock Yang, vice president of marketing at Nufront. In addition, CEVA's partner ecosystem, software development environment and DSP roadmap are unrivalled in the industry, further reinforcing our commitment to work together.

The relatively untapped high data rate communications markets in developing economies such as China and India present huge opportunities for high volume wireless chipset suppliers, said Eran Briman, vice president of marketing at CEVA. Emerging players such as Nufront are well positioned to address these markets through their direct relationships with local manufacturers and design houses that develop these wireless feature phones and smartphones. We are pleased to work with Nufront as they look to capitalize on this opportunity and join the ranks of our other key customers.

CEVA's industry-leading DSP cores power many of the world's leading wireless semiconductors, enabling unrivalled power consumption, performance and cost efficiencies in wireless solutions. The Company's wireless customer base includes, Broadcom, Intel, Mindspeed, Samsung, Spreadtrum, ST-Ericsson, VIA Telecom, Xincomm and now Nufront. Including over 15 design wins for LTE, CEVA has more than 35 wireless design wins to date, targeting a wide range of handset, mobile broadband and wireless infrastructure applications. In total, more than 1.5 billion CEVA-powered wireless processors have shipped.