New dummy components include packages like eWLP Embedded Wafer Level Packages, WLP Wafer Chip Size Packages, and TMV PoP Through Mold Via Packages. There are evaluation kits for TMV PoPs, and MLF MicroLeadFrame devices. An enhanced range of kits for rework and repair training are geared for those looking to conform to IPC 7711//7721 standards for reworking.
The catalogue details the most advanced certification and practice kits for through-hole, SMT and advanced SMT in the electronics assembly and rework industry, with many of the latest component technologies not generally found elsewhere.
