Analysis

BTU to Feature Next-Generation PYRAMAX Capabilities at NEPCON China

28th March 2012
ES Admin
0
BTU International, Inc. will highlight its next-generation High Efficiency (HE) Flux Management and dual-lane, dual-speed capabilities of the PYRAMAX solder reflow system as well as its latest WINCON 5.0 control system software in booth #1G65 at the upcoming NEPCON China 2012, on April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.
These next-generation PYRAMAX™ reflow ovens are setting the industry standard for thermal performance, providing electronics manufacturers with the highest throughput to compete successfully in today’s challenging marketplace. The HE Flux Management system features a new design that ensures clean oven operation, further extending the maintenance cycle. To reduce the downtime associated with oven maintenance, the HE flux management system is designed to allow service while the oven is in production.

The new version of WINCON 5.0 offers many new features including Windows 7 compatibility, dual process capabilities, maintenance manager and OPC functions. The dual process capability increases the functionality of PYRAMAX dual-lane dual-speed systems, allowing speed and rail set point changes on one lane while the other lane continues to process product maximizing throughput. Equipment maintenance reminders are provided through the maintenance manager function. The OPC function is an alternative to GEM Host and provides a way for customers to extract data from the system using OPC clients.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier