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VPG Announces Micro-Measurements' UK Training Session Schedule for 2013
AWR Sponsors and Exhibits a Wide Array of Technical Papers and Workshops at EDICON 2013
New LED-Downlight Reference Design from Power Integrations Achieves High-Performance Dimming While Reducing Component Count

AWR Sponsors and Exhibits a Wide Array of Technical Papers and Workshops at EDICON 2013

AWR is a gold sponsor at the Electronic Design Innovations Conference 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment, inclusive of Microwave Office/Analog Office circuit design software, Visual System Simulator system design software, as well as AXIEM 3D planar electromagnetic software and Analyst 3D finite element method EM software.
27 February 2013
byNews Desk

In addition to software demonstrations within booth #255, AWR will present a number of papers and workshops that include:

• Design of a Novel Multi-Slot Antenna
• MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
• RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
• Fully Integrating 3D Electromagnetic Simulation into Circuit Simulation
• Digital Pre-Distortion Techniques Workshop:
o Optimizing the Design and Verification of 4G RF Power Amplifiers
o Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion

Where:
Booth #255, Beijing International Convention Center, Beijing, China

When:
March 12-14, 2013

27 February 2013
byNews Desk

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27 February 2013
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