ASM AMICRA CoS wins productronica innovation award

The new CoS machine enables manufacturers to combine optical sensors and diodes with singulated substrates into powerful and extremely small packages with much more accuracy and speed than previous solutions. This advanced packaging technology forms the basis for new applications in 5G data transmission, 3D sensor technology, augmented reality, autonomous driving, as well as industrial and medical laser applications.

Dr Johann Weinhändler, member of the managing board of ASM AMICRA Technologies, said: “With the CoS machine we are setting new standards in chip-on-submount die-bonding by producing powerful opto-electronic packages with more precision and significantly more speed than before. Without this kind of progress in advanced packaging, many applications in the areas of 5G communication, sensor technology as well as industrial and medical laser technologies would be impossible to realise for technical as well as economic reasons. 

“Receiving the coveted Productronica Innovation Award is a great source of pride for our team. We also want to thank the many colleagues and developers in the entire ASM Group, who have supported us with their developments and technologies.” 

The CoS system combines the company’s dynamic alignment system for the precise placement of optical chips with new handling technologies for significantly shorter cycle times and a massive increase in productivity. 

ASM AMICRA reportedly accomplished this by integrating a rotating bonding station with two bonding positions and an innovative multi-pick head for the accelerated feeding and unloading of components. 

The eutectic bonding can be executed with an innovative and extremely powerful ceramic heater or with a laser. By bringing together all these innovations, the ASM AMICRA CoS achieves cycle times of six seconds with an accuracy of ±3 µm @ 3 sigma, which represents a new industry standard in accuracy and productivity.