Analysis

APLEX Display Latest Systems & Embedded Technologies At Embedded World 2013

25th February 2013
ES Admin
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APLEX Technology announces that a whole new set of products that are designed to meet a wide variety of industrial application demands will be showcased at the Nuremberg, Germany Embedded World 2013. At this exhibition, APLEX will represent new products such as FPD industrial Panel PCs, new generation of BOX PCs as well as demonstrations of wide temperature scenario for embedded products at APLEX booth No. 416, Hall 2.
FPD Industrial Panel PCs – APC-3918P & APC-3592

APLEX FPD industrial panel PCs are equipped with flat bezel IP65 certificated and IP 65 aluminium front panel, providing no Step, no Gap, and more slim benefits for users. The FPD Panel PCs are distinguished from different platforms in term of processing performance to meet various applications. For instance, APC-3918P is powered by Intel Socket P Core 2 Duo Processor, up to Intel P8600 2.4GHz processor, which can be used in factory automation, logistic process and kiosk fields. APC-3592 is using Atom low power D525 dual-core processor, which is suitable for storage controlling and food/chemical industry. The rich I/O design and expansion capabilities can fulfil multi-interface system and devices requirements.

New Generation of BOX PCs – ACS-266XC Series

APLEX Box PCs - ACS-266XC series, including ACS-2663C, ACS-2664C and ACS-2665C, adopts dual-core 1.86 GHz Intel Atom processor D2550 and Intel NM10 chipset, providing high computing performance and low power consumption and operates silently by means of its fanless design. As to storage capability, ACS-266XC series provides SODIMM connector for DDR3 800/1066 MHz up to 4 GB memory and supports one 2.5” SATA HDD. The newest ACS-266XC series also offers different expansion slots for options and is proved to work well in environments with temperature ranging from -10 to 50 degrees Celsius, which makes it ideal for machine controlling, factory automation or any other industrial applications.

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