Analysis

A MEMS Market Briefing at Transducers 2013

12th June 2013
ES Admin
0
Yole Développement and TRANSDUCERS 2013 Organizing Committee have joined forces to develop the most powerful event dedicated to the MEMS technology. This event takes place next week, in Barcelona, Spain.
During TRANSDUCERS 2013, Yole Développement is organizing the MEMS Market Briefing program including presentations and networking: on June 17 & 18 at 1.15 PM, discover the latest MEMS market & technologies trends. Make sure you will attend and be part of the discussions!

According to Yole Développement, TRANSDUCERS 2013 is one of the most famous event dedicated to the MEMS & Sensors world. Over three days, MEMS & Sensors industry leaders present the latest innovative manufacturing technologies, swap their visions of the industry and exchange insights on market developments … “The fast growing market for sensors forsmart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on annual ranking of the Top 30 MEMS companies”, announced Yole Développement’s analysts. The MEMS & Sensors industry is moving fast. Be sure you will be at the right place, at the right time!

The MEMS Market Briefing, powered by Yole Développement and sponsored by Coventor and Freescale takes place on June 17 & 18 (Level #1 – Room #116). During two sessions, we propose you to discover innovative MEMS manufacturing technologies and learn more about new business opportunities and emerging MEMS applications:

On June 17 – MEMS manufacturing technologies session

- Glass substrates for MEMS manufacturing
Christophe Fitamant, Sales & Marketing Director, Yole Développement
Glass is everywhere: from substrate, to carrier, to Wafer Level Capping - WLC - or 3D MEMS Through Glass Via – TGV. Most MEMS devices and sensors require Wafer Level Capping to protect or seal devices such as TPMS or some optical MEMS. Main drivers are cost, form factor and higher level of integration mainly supported by consumer applications that require less than 1.0 mm total package thickness. Wafer Level Packaging using Glass wafers is key enabler to be part of the fast growing market of consumers and automotive sensors.

- SEMulator3D - A virtual fabrication environment for MEMS & Semiconductors
Christopher J Welham, Worldwide Applications Engineering Manager, Coventor
Coventor describes a software platform that offers a range of development capabilities for the manufacture and assembly of MEMS and Semiconductor devices. The platform provides a systematic virtual development approach that avoids conventional trial-and-error experimental methods. Key capabilities include Virtual Fabrication, Process Variation Studies, Virtual Metrology, Design-Process Interaction and Predictive Modeling. Joint projects with leading foundries such as XFAB, Infineon and IBM are described that demonstrate the impact on the real manufacturing world…

On June 18 - Emerging MEMS Devices – Program will be completed soon
- Emerging consumer applications are boosting the growth of the MEMS pressure sensor market and reshuffling the main players
Christophe Fitamant, Sales & Marketing Director, Yole Développement
Pressure sensors are playing an important role today in modern industries. MEMS pressure sensor are one of the very first MEMS components appearing in the microsystem world and are already widely adopted in different applications for their high-performance, low costs and small sizes. Yole Développement provides a global overview of the current MEMS pressure sensor technologies, market and competitive landscape for automotive, industrial, medical, consumer and high end applications After years of limited growth, the MEMS pressure sensor market is growing again due to consumer electronic applications. For smartphones and tablets, it starts following the model of accelerometers and gyroscopes, resulting in significant growth.

- “Wireless Sensor Fusion – It’s already in volume production!”
Marc Osajda, Director, Pressure sensors business & EMEA sensor marketing, Freescale
The intend of the paper is to present the level of integration and low power consumption achieved in TPMS: pressure sensor - acceleration sensor - temperature sensor - voltage sensor - microcontroller with Flash memory, embedded firmware -wireless communication interface (LF and RF) - ultra low power consumption - ultra small - high quality - in volume production (millions produced) - designed, developed and Manufactured by Freescale …

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