The XCL-5000’s combination of speed and resolution make it particularly suitable for applications such as semiconductor pick-and-place machines. It will also be used by designers of mainstream machine vision and automated inspection systems who need to capture images with a high level of detail to increase system productivity: and in equipment for medical microscopy, security and food and beverage production.
The inclusion of the Camera Link interface allows systems integrators to retain a traditional frame-grabber architecture to pre-process images, or even to use the XCL-5000 in conjunction with existing hardware, to improve system resolution. The module is compatible with most common brands of frame grabber, including those from National Instruments and Euresys, further easing the systems integration task.
The XCL-5000’s interline transfer (IT) CCD produces inherently high image quality, not only in terms of resolution but also sensitivity (F5.6 at 400lx) and minimum illumination (1lx). The module also includes a binning function and 3 x 3 real-time image pre-processing filter. The use of partial scan technology can produce an increase in effective frame rate by reading out only selected portions of the target image, enhancing performance in high-speed applications.
Unlike many competing Camera Link devices, the XCL-5000 has a small form factor of just 44 x 44 x 57.5mm and weighs only 135g. It is designed for use in industrial environments, with shock resistance of 70G and vibration tolerance of 10G. Operating temperature is -5 to 45°C, and the unit requires only a single 12V DC power supply, with maximum power consumption of 3.6W.