RDA Microelectronics Sampling Wi-Fi Combo Chip

The RDA5990 integrates a complete IEEE 802.11 b/g system with Bluetooth 2.1 + EDR and FM radio receiver and transmitter. Combining several proven wireless technologies onto a single silicon die allows the components to work simultaneously and independently, while consuming less power and improving battery life. RDA's superior integration design uses 55nm CMOS process in a compact 6x6 mm 48-pin QFN package, minimizing board space and reducing customer cost. Manufacturers can quickly integrate the RDA5990 on platforms to enable rapid time to market.

Commenting on the product introduction, Vincent Tai, chairman and CEO of RDA Microelectronics, stated, Integrating Bluetooth, FM and Wi-Fi on a single CMOS die is very challenging and there are only a few companies in the world with proven products in the market. This Wi-Fi combo chip represents a significant milestone in our product development roadmap and demonstrates the strength of our integration capabilities. This chip has one of the smallest die size in the market and is very competitive in terms of performance and cost. The customer interest for this product is extremely high as they have been very eager for us to introduce this chip.

This product also represents our continued efforts to further penetrate the 3G/4G smartphone market. Most smartphones offer Wi-Fi functionality as a standard feature to enable higher data speeds. Smartphones have shown a 22% CAGR in global volume over the past five years, and it is expected that low-end smartphone volumes will rise rapidly in China as the prices begin to decrease. I believe RDA is well positioned with this product to capitalize on this growing opportunity. RDA generates higher revenue per handset from smartphones than from 2G feature phones, and we expect this product and other products targeted at the 3G/4G market will produce significant revenue over the next several years.