The SAGEM HiLoNC delivers leading edge technology in the lightest, most compact package available with an exclusive SMT package. This is more flexible to the alternative Ball Grid Array (BGA) format. Its feature set includes full quad band support, GPRS Class 10, voice, SMS, MMS, CSO and fax capability and integrated TCP/IP and UDP stacks.
Smaller than a postage stamp (24mm x 24 mm x 2.5mm) and weighing less than 2.8g, the new component is designed to withstand an operating temperature range of -40˚c up to +85˚c – the most extended on the market. The enhanced, rugged mechanical design is adapted to comply with industrial and automotive constraints making the Hi/Lo an extremely reliable component for use in the industrial M2M market. The module operates using minimal power consumption of <1.5 mA in standby mode and is designed to deliver an extended sensitivity level and longer battery life which is essential in the world of battery-powered M2M electronic devices. Christos Papakyriacou, Managing Director, Alpha Micro Components comments: “This strategic addition to our M2M portfolio responds to the increasing demand we’re seeing for ‘miniaturised’ products. The introduction of the SAGEM HiLoNC to our offering of embedded M2M solutions will open the door to those requiring reliable, efficient and affordable components for integrated devices, particularly in today’s economic climate.”