Fingerprint cards for next-generation biometric payments
As a second step in their announced partnership, Fingerprint Cards AB (Fingerprints) has entered into a commercial agreement (MoU) with STMicroelectronics to bring the joint platform to market. The platform improves the efficiency of the key features a of biometric system-on-card, demonstrating simple user enrolment, very high end-to-end banking transactions and matching performances.
STPayBio integrates ST’s payment security technologies, the ST31 Secure Element (SE) and STM32 microcontroller (MCU), with Fingerprints’ T-Shape 2 (T2) sensor module and software platform for payments which was recently approved by Mastercard. The two companies have been working tightly together to optimise all parts of the platform in one solution. The platform eases integration of biometrics into existing card manufacturing processes, enabling global volume deployments, and reducing the total product cost.
“Achieving this second step of STMicroelectronics and Fingerprints collaboration by providing a proven BSoC integrated solution, we are confirming our strong partnership with Fingerprints and have all the key ingredients to provide a commercial solution bringing increased level of security and convenience for issuers and card holders,” said Laurent Degauque Marketing Director, Secure Microcontrollers, STMicroelectronics.
“Biometric payment cards can offer value to consumers across the globe, and demand is growing quickly now that we’re seeing commercial launches in Europe,” added Michel Roig, SVP Business Line Payments & Access at Fingerprints. “We’re proud to continue this collaboration to reduce cost and remove complexity from the integration process. This is breaking down major barriers for smaller, tier 2 card manufacturers to add biometric cards to their portfolio and, in turn, bring fast, frictionless and hygienic in-store payments to even more consumers.”
The companies will start joint go-to-market of the platform, and the solution will be available for customer samples in Q3 2021.