This high-performance via filling and simultaneous through-hole acid copper electroplating process is designed to allow increased reliability of complex, High Density Interconnect (HDI) Printed Circuit Boards (PCBs) for next-generation technologies.
The growth in high-performance servers for AI applications, advanced automotive systems, and high-speed networking infrastructure is driving demand for more complex, multilayer boards that must meet stringent reliability and performance requirements.
MacuSpec VF-TH 500, the latest solution in MacDermid Alpha’s award-winning MacuSpec VF-TH series, provides fabricators and OEMs with a versatile solution to meet these requirements.
MacuSpec VF-TH 500 is designed for HDI boards that require simultaneous via filling and through-hole plating with excellent microdistribution for panel plating and modified Semi-Additive Processing (mSAP) pattern plating. The chemistry provides high via filling performance for via sizes up to 200 x 100 µm. Fabricators can expect a reliable deposit and improved throwing power at the knee and through-hole.
“To meet the reliability and performance requirements for high-density interconnects, fabricators are often faced with challenges associated with large vias and complex via structures,” said Dr. Kesheng Feng, Director of Metallization Research, MacDermid Alpha. “MacuSpec VF-TH 500 delivers outstanding results for mSAP with minimal copper addition to the surface. This enhances line/space reduction, boosts circuit density, and improves signal transmission. The process is highly versatile, meeting the needs of advanced fabricators.”
MacuSpec VF-TH 500 offers fabricators the following process benefits:
- Panel, pattern, or button plating capability.
- Compatible with VCP or vertical hoist equipment.
- Flexible options for both insoluble and soluble anode systems.
- Works seamlessly with direct metallisation or electroless copper, ensuring reliable microvias with epitaxial growth across the interface.
