The new power switch products both comprise eight channels and are high-side (TPD2015FN) and low-side (TPD2017FN) switches. Both devices benefit from Toshiba’s latest analogue device process (BiCD) that combines bipolar, CMOS, and DMOS technologies.
Both of the products are housed in the small 0.65mm pitch SSOP30 package that measures just 9.7×7.6×1.2mm. This offers a reduction of around 29% in mounting area and 20% in height over the SSOP24 package (13.0× 8.0×1.5mm) that is used for current products such as the TPD2005F and TPD2007F, thereby reducing the size of designs.
With regard to the electrical performance, the on-resistance (RDS(ON)) of both devices is 0.4Ω – more than 50% less than that of Toshiba’s current products, significantly enhancing operating efficiency and enhancing thermal performance. The rugged power switches are able to operate at temperatures (Topr) from -40°C to +110°C with a junction temperature (Tj) as high as +150°C, ensuring their suitability for challenging industrial environments.
In addition, both products have built-in over-current protection circuits and over-temperature protection circuits, thereby ensuring the reliability of the equipment they are used in.