Texas unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centres built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, 16-19 March, 2026, at NVIDIA’s power architecture display and TI’s booth 169, demonstrating how TI’s analogue and embedded processing technology supports NVIDIA’s vision for advancing high-voltage systems in AI data centres.
“The exponential growth of AI computing demands a fundamental rethinking of how we deliver power in data centres,” said Kannan Soundarapandian, vice president and general manager of high-voltage power at TI. “Our advanced 800 VDC architecture represents a critical breakthrough that enables data centre operators to meet today’s power challenges while preparing for tomorrow’s AI workloads. By collaborating with NVIDIA, we’re helping accelerate the deployment of AI infrastructure that can scale efficiently and reliably.”
Addressing critical power challenges in AI infrastructure
As AI workloads continue to drive unprecedented power requirements in data centres, traditional power distribution architectures are reaching their limits. TI’s 800 VDC architecture addresses these challenges by maximising conversion efficiency and power density across the entire power path, simplifying the power architecture and enabling more scalable and reliable AI data centre operations.
TI’s breakthrough approach requires only two conversion stages from 800V to GPU core power: compact 800V to 6V isolated bus converter with higher peak efficiency, followed by a 6V to <1V multiphase buck solution with high current density generation-over-generation. This streamlined architecture supports the NVIDIA reference design.
Complete power solution
TI’s comprehensive 800 VDC power architecture solution shown at NVIDIA GTC includes multiple breakthrough reference designs with industry-leading specification:
- 800V hot-swap controller: Scalable hot-swap solution for input power protection for 800V rails
- 800V to 6V DC/DC bus converter: High density solution featuring integrated GaN power stages, delivering 97.6% peak efficiency with >2000W/in3 power density for compute tray applications
- 6V to <1V multiphase buck converter: High-current solution for advanced GPU cores, with higher power density vs 12V designs and featuring dual-phase power stages.
In addition to these designs, TI will showcase a 30kW 800V high power density AC/DC PSU for AI servers and 800V capacitor bank units (CBU) with 40W/in3 power density using EDLC super capacitor cells. TI will also be featuring an 800V to 12V DC/DC bus converter for compute tray power conversion.
Accelerating development of future generation AI data centres
As the data centre industry experiences growth driven by AI and Edge computing, TI’s analogue and embedded processing technologies deliver what’s needed to efficiently power and manage advanced AI workloads. From solid-state transformers to sidecar and server IT racks, and cooling distribution units, TI’s scalable semiconductor solutions help pave the way for future AI infrastructure deployments.
