Both series are glass-passivated chips with low leakage current, bidirectional configuration and clamping capability. They also have a fast response time and are RoHS and REACH compliant. The PAM28DOACxxCA series is provided in a molded JEDEC DO-214AC package and has an approximate weight of only 0.06g.
The PAM29DOAAxxCA series is offered in a molded JEDEC DO-214AA package and have an approximate weight of 0.103g. Both series have lead-free pure-tin plating (annealed) and a solder reflow temperature (pure-tin – Sn, 100) of 260 to 270°C. The terminals in both series can be soldered per MIL-STD-750, method 2026. They also both carry a flammability rating of UL 94V-0.
The operating and storage temperature range for both series is -55 to 150°C. Both series are offered in 12mm tape and reel, per EIA standard 481. Minimum quantities start at 500 components.