FRAMOS Sensor Tech Days 2018 presents the latest news

21st March 2018
Posted By : Enaie Azambuja
FRAMOS Sensor Tech Days 2018 presents the latest news

The third FRAMOS Sensor Tech Days conference, held from 15th to 16th May in Hamburg, Germany, will offer the ideal platform for vision system developers to share information and exchange ideas. This workshop will feature exclusive presentations by SONY Japan, ON Semiconductor, INTEL and XILINX on current vision developments, new products and technologies and future trends and innovations.

The conference will focus on Embedded Vision, Industrial Automation and a broad variety of lead-edge applications, as well as talks on effective equipping, suitable lens solutions and 3D imaging.

Day one, SONY Japan will show insights about new CMOS leading technologies, an overview on its sensor roadmap and present its new on-chip polarisation technology with live demonstration. XILINX speaks on how innovation in FPGA's is enabling the next generation vision systems.

Based on the leading-edge SLVS-EC interface, FRAMOS will introduce the inhouse-developed SLVS-EC IP Core for Xilinx FPGA blocks, promising shorter development cycles and accelerated design time.

Sensor Development specialist, First Sensor, will be discussing packaging technology for bare die sensors. The FRAMOS' lens and sensor experts will explain how to come from a system MTF chart to a sensor MTF chart, and will talk about the technical lens innovations set to determine the quality of vision systems in the future. The first day will be closed with networking and discussion opportunities on a dinner event.

"The aspects I liked most were pretty much that the event addresses leading-edge technologies and you have the opportunity to talk directly to company representatives from the major players, like SONY Japan.

The technology roadmap updates, technical details and overall demonstrations gave super helpful insights on a deep level for vision system engineers and developers, together with the networking with the suppliers and peers." --- Attendee from the FRAMOS Sensor Tech Days 2017

Day two, Intel® will outline how perception and 3D vision can be an advantage in vision, using new Intel® robust computer vision technologies for depth sensing in multiple formats. They will take the audience on a walk thru RealSense functionality principles, building scalable elements, usage scenarios and solutions.

ON Semiconductor will present the company's current product range and roadmap supporting the variety of future vision applications by advanced technologies like EMCCD, and depth technology. They will introduce a new versatile family of Global Shutter CMOS image sensors for the first time at the FRAMOS Sensor Tech Days 2018.

Leading lens company Fujinon will give an introduction on its new anti-shock & vibration technology for consistent image quality in robotics and in high-vibration industrial environments.

Customised sensor specialist Pyxalis will talk about fully customised and semi-customised sensor solution to meet the requirements of modern vision applications creating uniqueness and outstanding performance. During both conference days, there will be many opportunities for participants to network with fellow attendees and specialists.

The FRAMOS Sensor Tech Days will be held from May 15-16 at the Holiday Inn Hamburg located near the Elbe bridges. To attend, register online at FRAMOS Imaging Experts Academy for a price of €399 plus VAT. Register early by 30/03/2018 to benefit from the early bird rate of €299 plus VAT. A limited number of hotel rooms are available at discounted rate.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

electronica 2018
13th November 2018
Germany Messe Munchen
SPS IPC Drives 2018
27th November 2018
Germany Nuremberg
International Security Expo 2018
28th November 2018
United Kingdom London Olympia
The Security Event 2019
9th April 2019
United Kingdom NEC, Birmingham
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)