Parker Chomerics
Parker Chomerics Articles
Thermal gels target mission critical electronics
The Chomerics Division of Parker Hannifin Corporation has launched two high-performance, high-reliability, fully cured dispensable thermal gels.
Microwave absorbers prove themselves in ADAS applications
The Chomerics Division of Parker Hannifin reports that its CHO-MUTE 9005 and 9025 elastomer-based microwave absorber materials successfully protect advanced driver assistance systems (ADAS) from electromagnetic interference (EMI), a vital requirement for these life-saving and increasingly essential systems.
Parker Chomerics unveils THERM-A-GAP GEL 50TBL, dispensable thermal gel that excels in thin bond line applications
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is introducing a new thermal interface material for use in very thin bond lines without compromising performance.
Parker Chomerics unveils THERM-A-GAP GEL 50TBL
Parker Chomerics has introduced a new thermal interface material for use in very thin bond lines without compromising performance.
Parker launch new gap filler pad for high thermal conductivity
The Chomerics Division of Parker Hannifin Corporation has announced its new THERM-A-GAP PAD 80 high-performance gap filler pad is now available.
Parker releases high-flow thermal gel for high-volume applications
The Chomerics Division of Parker Hannifin Corporation is unveiling a new thermal interface gel that is ideal for all manufacturers faced with meeting the challenges of high-throughput production.
Sealant offers corrosion and chemical resistance
The Chomerics Division of Parker Hannifin has released CHO-BOND 1018, a two-component, electrically conductive polythioether that acts as a fillet, gap filler or seam sealant for high level EMI/RFI shielding for today’s advanced electronic systems.
Parker's release new thermal interface gel for automotive applications
The Chomerics Division of Parker Hannifin has announced its new THERM-A-GAP GEL 20, a one-component thermal interface material with 2.4W/m-K thermal conductivity ideal for automotive industry applications. This product offers easy dispensing and is fully cured (no secondary cure required) to accommodate the automotive sector's high reliability requirements for thermal cycling and high-temperature environments.
Parker release new generation of dispensable Thermal Gels
The Chomerics Division of Parker Hannifin has unveiled THERM-A-GAP GEL 40NS, the next iteration in its line of silicone-free, thermally conductive gels. This one-component, low-outgassing material features a special formulation to meet the stringent requirements of silicone-sensitive applications such as optical equipment, camera modules, high-performance sensors and data storage devices, Chomerics state.
Non-silicone, thermal gels available from Parker
The Chomerics Division of Parker Hannifin Corporation has unveiled THERM-A-GAP GEL 40NS, the next iteration in its line of silicone-free, thermally conductive gels.
Parker Chomerics protects drones with EMI shielding
Parker Chomerics has launched new solutions to protect drones from electromagnetic interference and overheating.
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