To back up the company’s knowledge in creating semiconductor technology for USB power delivery purposes, FTDI Chip has now announced a new development solution. This hardware is based on its FT4233HP multi-channel interface ICs.

In order to strengthen its portfolio of devices supporting USB power delivery, FTDI Chip has unveiled the FT23xHP series. These compact, streamlined interface ICs are supplied in QFN packages. They support operation across just one channel, thereby enabling systems that are subject to space or budgetary constraints to still benefit from elevated levels of power delivery via their USB ports.

FTDI Chip’s latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol.

The USB power delivery technology necessary to go beyond the powering of consumer electronics products and support the elevated current levels required by larger items of electronic equipment has been introduced by FTDI Chip. The FT4233H is an advanced bridge IC with USB Type-C connectivity and USB power delivery (PD) Rev. 3.0 controller capabilities, supporting applications up to 100W.

  To complement its FT602 USB 3.1 (Gen 1) video class FIFO IC, which has now gone into full scale production, FTDI Chip has introduced a pair of accompanying hardware modules. The UMFT602A and UMFT602X units enable bridging of a FIFO bus to a USB3.0/1 host and are equipped with either HSMC or FMC (LPC) connectors.

FTDI Chip has introduced the highly advanced LC231X USB-to-serial UART bridging module, which is based on the company’s FT231X interface IC. This compact (15.24x28.19mm), cost-effective unit presents engineers with jumper-selectable power to external I/O (either 3.3V or 5V, as required) and UART interface with full modem handshaking control at up to 3MBaud data rate.

FTDI Chip has added to the breadth of supporting products within its X-Chip portfolio. Firstly, there is the introduction of the highly advanced LC231X USB-to-serial UART bridging module, which is based on the company’s FT231X interface IC. This compact (15.24mm x 28.19mm) and highly cost-effective unit presents engineers with jumper-selectable power to external I/O (either 3.3V or 5V, as required) and UART interface with full modem handsha...

Continuing to drive innovation in USB technology, FTDI Chip has now introduced a series of USB 3.0 UVC class bridge ICs. The company’s FT602 devices support the streaming of video content from high definition camera equipment. This means that imaging systems which would have previously only been capable of delivering relatively low resolution material can gain substantially elevated video quality but still run at 60fps frame rates.

Having already seen strong market uptake of the initial CleO smart display solution for rapid development of human ma-chine interfaces (HMIs), Bridgetek and FTDI are now expanding this product family to include a higher end version. Based on the widely-praised Embedded Video Engine (EVE) technology, the new CleO50 shield has a larger 5.0” diagonal 800 x 480 pixel resolution TFT with built-in resistive touch screen, plus enhanced audio capab...

In order to better serve the broadening range of markets it has developed products for, FTDI Chip has established a new distinct company - called Bridgetek. Presenting the embedded engineering sector with a well-defined and targeted operation, Bridgetek will drive the further commercialisation of some of the game-changing technologies introduced by FTDI Chip in recent years.

  After the incredible response to its crowdfunding project earlier this year, which raised 3.25 times the original target, FTDI Chip announces full availability of the CleO product (and accompanying accessories) through its distribution partners, as well as directly via the company’s website.

Comprehensively supporting engineers implementing USB into their embedded systems, FTDI Chip has just introduced two board level products, as well as a new IC. The UMFTPD3A programmer module is designed for use with the company’s development hardware and ICs containing either internal One-Time Programmable (OTP) memory or eFUSE logic (which are both used to store USB vendor ID, product ID product description data, etc.), the FT260 and FT422...

To provide engineers with a greater breadth of IO options and also address demands to conserve board real estate, FTDI has announced recent versions of its highly popular FT2232H and FT4232H devices. These configurable USB 2.0 Hi-Speed (supporting 480Mbit/s operation) ICs are now available in 56-pin VQFN packages, which complement the 64-pin LQFP package format.

Ensuring that USB technology is as straightforward to use as possible, FTDI Chip has announced the FT260 HID class interface controller IC. It can provide USB 2.0 Full Speed (12Mb/s) connectivity to a broad range of application scenarios - including connection of touchscreens, computer peripherals and IoT sensing apparatus, as well as USB interfacing of microcontroller or programmable logic centric system designs, plus industrial automation equip...

In order to support the FT51A MCU, which is now in full production, FTDI Chip has introduced an array of board levels products which will enable engineers to become more familiar with this MCU platform. This allows them to see just how versatile it is and gauge the performance it delivers, before putting their first prototypes into action.

FTDI Chip has introduced its latest product, NerO, being introduced on KickStarter. The objective of NerO is to deal with the fundamental drawbacks of the widely used Arduino UNO R3 and, by utilising a crowdfunding platform, get the engineering community involved right from the very beginning.

FTDI Chip has added to the support it can offer to engineers using its highly regarded X-Chip series by introducing an array of breakout boards. Through these compact, low-profile items, the bridging of USB 2.0 (full speed) signals to serial or parallel interfaces is facilitated.

FTDI Chip has introduced a series of easy-to-utilise modules to facilitate the evaluation, development and subsequent implementation of its 32-bit FT90X Super-Bridge MCUs. This will mean that engineers in the embedded space are better positioned to benefit from the industry-leading performance levels and extensive connectivity that these highly advanced ICs are able to deliver.

FTDI Chip continues to enlarge the development ecosystem surrounding its Embedded Video Engine (EVE) platform for advanced HMI implementation. The latest additions concern the FT810 series of high resolution EVE ICs, which are now in full scale production. In order to support these devices, the company has announced the VM810C50 family of compact development modules.

To encourage the use of its easy-to-implement next gen USB interfacing technology, FTDI Chip has unveiled a family of evaluation/development modules. The company’s FT600/1Q USB 3.0 SuperSpeed ICs, which are already in full volume production, are backed up by the UMFT60XX offering. This module family is made of 4 models, which provide different FIFO bus interfaces and data bit widths.