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Faraday Technology

Faraday Technology Articles

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Artificial Intelligence
12th March 2018
Enabling the AI revolution with FPGA-to-ASIC conversion

  Faraday Technology has announced its FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power saving, enhanced performance and lower system cost to meet the specific AI requirement.

Analysis
2nd November 2017
High margin products push growth at silicon IP provider

Fabless ASIC service and silicon IP provider Faraday Technology has reported third quarter consolidated revenue of NT$1,269 million, down 16.0% quarter-over-quarter while gross margin reached 52.5%, up five percentage points from the previous quarter. In the third quarter, Faraday’s product mix continued to improve.

Analysis
12th July 2017
Electric car factory ceases construction

Despite commencing building in April last year, Faraday Future halted construction on its Nevada factory in October, and now work has been postponed indefinitely.

Analysis
17th January 2017
Does Faraday's Future hang in the balance?

At CES this year, a fairly new company Faraday Future, which is in an electric car competition with Telsa, went all out with its press event and revealed a mystery car concept. Electronic and car enthusiasts were on the edge of their seats in Las Vegas last month as it was revealed that it had financial backing from Chinese billionaire Jia Yueting, and had received $335m worth of incentives from the state of Nevada last month to bu...

Design
6th January 2017
Virtual prototyping solution accelerates software development

  Faraday Technology Corporation and Synopsys have announced the expansion of Faraday's design services to include a virtual prototyping solution. 

Communications
8th April 2010
Faraday Launches Its USB 3.0 PHY in UMC 90nm

Faraday Technology Corporation today announced the availability of its commercial USB 3.0 physical layer (PHY) at UMC 90nm high-speed (HS) process. With smaller size and lower power consumption than peers', this new component is developed based upon USB 3.0 version 1.0 specification functionally and electrically, achieving the maximum speed of 5.0Gbps.

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