From 3D printing to lithography

28th August 2015
Posted By : Siobhan O'Gorman
From 3D printing to lithography

TI DLP Products is reinforcing its reputation in imaging technology with the release of the DLP9500UV chipset. The latest addition to its portfolio features the highest resolution UV DLP chip to quickly expose and cure photosensitive materials in industrial and medical imaging applications.

DLP Products is no stranger to working with UV imaging, having previously offered UV products to our DLP Design House partners. Along with the DLP9500UV, this fall we will offer a second UV chipset, the DLP7000UV, available publicly for developers.

Both the DLP7000UV and DLP9500UV Digital Micromirror Devices (DMD) enable high resolution, fast-pattern switching speed, and are optimised for exposure in the 363-420nm wavelengths.

While both chipsets offer low thermal resistance, high optical power (up to 2.5W/cm²), and a package window optimised for UV wavelength transmission, there are a few key differences between the chipsets that developers should note. If you’re looking for the fastest UV DLP chip available and one that is suited for mid-range platforms with a competitive price point, the DLP7000UV chipset is a great solution. But, if you want higher resolution with a pixel loading speed of up to 48Gps for fast production cycle times, you should consider the DLP9500UV chipset.

The DLP9500UV chipset boasts a powerful combination of resolution and speed for developers to get started. It has more than 2m micromirrors (1920 x 1080) which enable end equipment to image large exposure areas with few print heads, and it supports print feature sizes approaching 1µm. Additionally, it’s combined with the DLPC410 digital controller, DLPR410 configuration PROM and DLPA200 DMD micromirror driver, which enable its fast micromirror loading speed.

This flexible solution can be used in a wide range of applications, including direct imaging lithography; 3D printing; laser marking; LCD/OLED repair; computer-to-plate printers for industrial applications; and ophthalmology, phototherapy and hyperspectral imaging for medical applications.

So, what does all this mean for developers? The DLP UV chipsets have already helped to make the production of printed circuit boards an efficient process with the unique patterning of the electronic designs and solder masks on boards. These efficiencies lead to a high output at a low cost. Adding theDLP7000UV and DLP9500UV to the TI DLP portfolio allows the chipsets to be accessible and available to developers.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
HETT 2019
1st October 2019
United Kingdom EXCEL, London
World Summit AI 2019
9th October 2019
Netherlands Taets Park, Amsterdam
New Scientist Live 2019
10th October 2019
United Kingdom ExCeL, London
GIANT Health Event 2019
15th October 2019
United Kingdom Chelsea Football Club Stadium, London