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The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Marc Winfield will be promoted to President of TTI IP&E – Europe

Marc Winfield will be promoted to President of TTI IP&E – Europe

Marc Winfield will be promoted to President of TTI IP&E – Europe

Appointments

28 September 2026

See-free PO: robots can’t see properly yet, but it’s coming

See-free PO: robots can’t see properly yet, but it’s coming

See-free PO: robots can’t see properly yet, but it’s coming

Robotics

28 September 2026

Meet today’s engineering students who are building our future

28 September 2026

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Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Marc Winfield will be promoted to President of TTI IP&E – Europe

Marc Winfield will be promoted to President of TTI IP&E – Europe

Marc Winfield will be promoted to President of TTI IP&E – Europe

Appointments

28 September 2026

See-free PO: robots can’t see properly yet, but it’s coming

See-free PO: robots can’t see properly yet, but it’s coming

See-free PO: robots can’t see properly yet, but it’s coming

Robotics

28 September 2026

Meet today’s engineering students who are building our future

28 September 2026

Home Archives for News Desk Page 53

How will the European Union AI Act impact you?

12 December 2025

How Edge AI Will Transform the Next Generation of Connected Systems

How Edge AI Will Transform the Next Generation of Connected Systems

How Edge AI will transform the next generation of connected systems

Artificial Intelligence

12 December 2025

The importance of anti-tamper solutions in an era of evolving security threats

Security

12 December 2025

MCB vs. eFuse: which is the best solution for properly securing DC circuits?

Power Supplies

12 December 2025

Synopsys to showcase future of automotive engineering

Synopsys to showcase future of automotive engineering

Synopsys to showcase future of automotive engineering at CES 2026

12 December 2025

The global test and measurement (T&M) market is expanding from $34.11 billion in 2024 to an estimated $43.95 billion by 2030.

The global test and measurement (T&M) market is expanding from $34.11 billion in 2024 to an estimated $43.95 billion by 2030.

Powering precision: why the future of high-power test benches must be fully integrated and automated

Test & Measurement

12 December 2025

Pico Technology announces major upgrade to PicoScope 7

Pico Technology announces major upgrade to PicoScope 7

Pico Technology announce upgrade to PicoScope 7 software

Test & Measurement

12 December 2025

Academic institutions are getting hands-on with additive manufacturing to create more engaging courses that better prepare students for their careers ahead, writes Jesse Roitenberg, an education specialist from Stratasys.

Academic institutions are getting hands-on with additive manufacturing to create more engaging courses that better prepare students for their careers ahead, writes Jesse Roitenberg, an education specialist from Stratasys.

How additive manufacturing is inspiring the next generation of technical talent

Design

12 December 2025

Yet, in the rush to innovate and ship at speed, cybersecurity has often been an afterthought. For IoT and IIoT vendors, the arrival of post-quantum cryptography (PQC) standards represents one of the most significant – and complex – security transitions yet.

Yet, in the rush to innovate and ship at speed, cybersecurity has often been an afterthought. For IoT and IIoT vendors, the arrival of post-quantum cryptography (PQC) standards represents one of the most significant – and complex – security transitions yet.

A not-so-small challenge: post-quantum upgrades for embedded IoT devices

12 December 2025

As embedded systems evolve to support more complex applications ranging from industrial automation to connected automotive and advanced IoT devices, designers face mounting challenges in balancing performance, flexibility, and reliability. The ability to scale design and integrate diverse peripherals is central to overcoming these challenges and future-proofing designs.

As embedded systems evolve to support more complex applications ranging from industrial automation to connected automotive and advanced IoT devices, designers face mounting challenges in balancing performance, flexibility, and reliability. The ability to scale design and integrate diverse peripherals is central to overcoming these challenges and future-proofing designs.

Overcoming modern embedded design challenges with high-performance MCUs and integrated peripherals

Design

12 December 2025

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

onsemi & FORVIA HELLA extend collaboration with power tech

12 December 2025

Ethernet switch bridges gap between traditional and chip-level

Ethernet switch bridges gap between traditional and chip-level

Ethernet switch bridges gap between traditional and chip-level

Industrial

12 December 2025

SoC delivers cutting-edge Wi-Fi solution

SoC delivers cutting-edge Wi-Fi solution

SoC delivers cutting-edge Wi-Fi solution

Internet Of Things (IOT)

12 December 2025

Vehicle management unit a match for next-generation mobile robotics

Vehicle management unit a match for next-generation mobile robotics

Vehicle management unit a match for next-gen mobile robotics

Robotics

12 December 2025

Quintauris and SiFive announce partnership

Quintauris and SiFive announce partnership

Quintauris and SiFive announce partnership to advance RISC-V ecosystem development

Design

12 December 2025

Quantum computing is cold inside: but the quantum era is rapidly hotting up

Quantum Tech

12 December 2025

Melexis has introduced a new inductive position-sensing chip aimed at robotics, industrial automation, and emerging mobility systems, as demand grows for compact, high-precision alternatives to optical and magnetic encoders.

Melexis has introduced a new inductive position-sensing chip aimed at robotics, industrial automation, and emerging mobility systems, as demand grows for compact, high-precision alternatives to optical and magnetic encoders.

Melexis launches 16-bit inductive sensor as robotics and mobility demand rises

11 December 2025

xMEMS Labs will use CES 2026 to unveil a pair of silicon-based audio and cooling technologies that it says will underpin a new generation of thinner, lighter AI-enabled consumer devices, as the sector shifts towards what it calls “Physical AI”.

xMEMS Labs will use CES 2026 to unveil a pair of silicon-based audio and cooling technologies that it says will underpin a new generation of thinner, lighter AI-enabled consumer devices, as the sector shifts towards what it calls “Physical AI”.

xMEMS to unveil solid-state audio and cooling technologies aimed at next-generation AI wearables at CES

11 December 2025

Real-Time Innovations plans to unveil the latest version of its software-defined vehicle platform at CES 2026, as competition intensifies around tools that promise to accelerate development of next-generation automotive systems.

Real-Time Innovations plans to unveil the latest version of its software-defined vehicle platform at CES 2026, as competition intensifies around tools that promise to accelerate development of next-generation automotive systems.

RTI to debut AI-enhanced software defined vehicle platform at CES 2026

Events News

11 December 2025

Amphenol RF eco-friendly PFAS-free SMA connectors & adapters

Amphenol RF eco-friendly PFAS-free SMA connectors & adapters

Amphenol RF eco-friendly PFAS-free SMA connectors & adapters

Cables/Connecting

11 December 2025