tionally, to serve market demands for small scale component inspection, the V810 is now equipped with Variable Magnification at 11 and 19 micros to provide end-users with better magnified images and resolution on small components such as 01005s and .2 mm CSPs.
Winner of Global Technology and NPI Awards, the V810 is the latest revolution in X-ray technology inspecting double-sided panels with high defect coverage, high inspection speed and an excellent call rate. The system is designed for in-line and offline use and works on both lead and lead-free solder joints. The V810’s state-of-the-art technology is based on Digital Tomosynthesis methodology and runs on a new platform with Windows 7 Professional 64bit.
Also on display, the new generation V510 G2 Series AOI system offers greater performance for faster inspection with inspection speeds up to 55 cm2/sec for post-reflow and 65cm2/sec for pre-reflow. The system features low power consumption with a brilliant LED monitor display and improved ergonomic adjustment to increase viewing comfort (sit-stand operation). The new multi-shot imaging technology enables the system to capture up to 180 frames per second and the multi-core processing technology significantly enhances inspection time. Additionally, the monochrome color camera via solid state modeling technologies enables best-in-class color inspection.