TI is very proud of this award. STI strivesWe strive daily to provide technological solutions to today’s electronics manufacturing challenges forto our customers and this award is proof that we are headed in the right direction,” saidys David Raby, President/CEO.
The Micro-Coil Spring Array is an improved alternative to standard rigid arrays to replace the Column Grid Array (solder columns) commonly used on Integrated Circuits (IC) with a very high lead count. The Micro-Coil Spring Array was developed by NASA for a higher degree of reliability over conventional Column Grid Arrays and this technology was licensed to STI Electronics Inc. for its commercialization and production capability.
The Micro-Coil Spring Array is a drop-in replacement for BGA Column Grid Array packaging applications that require greater reliability and long-term robustness. Additionally, it is competitively priced to be lower than Column Grid Array solder columns. Production assembly costs also are lower than for manufacturing the Column Grid Array package.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.