Kyzen to Debut New Advanced Packaging Cleaning Chemistry at NEPCON South China 2011

27th July 2011
Posted By : ES Admin
Kyzen to Debut New Advanced Packaging Cleaning Chemistry at NEPCON South China 2011
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will introduce AQUANOX A4638 ― its newest advanced packaging cleaning chemistry ― in booth 1J50 at the upcoming NEPCON South China 2011 exhibition and conference. The event is scheduled to take place August 30-September 1, 2011 at the Shenzhen Convention & Exhibition Centre.
is an engineered electronics assembly and advanced packaging cleaning agent. Designed to remove flux residue from flip chip and low clearance components, A4638 will rapidly remove water-soluble polar flux residues at low concentrations, providing a low cost of ownership. AQUANOX® A4638 is a nonhazardous, biodegradable aqueous solution. It contains no CFCs or HAPs.

AQUANOX® A4638 is RoHS compliant, Halogen, Halide and Hexane free. It has proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. The Kyzen Applications Laboratory has evaluated AQUANOX® A4638 for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.


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