Kyzen has today revealed that Dr. Mike Bixenman will present a paper titled “Cleaning Challenges in an HDI World – Phase 3” at the upcoming IPC Midwest Exhibition & Conference in Schaumburg, IL. Co-authored with Mark Northrup of IEC Electronics and Joe Russeau of Precision Analytical Laboratory, the presentation will take place during Session S01, titled “Reliability Challenges for Bottom Termination Components” on Wednesday, August 22, 2012 from 9-11:45 a.m.
tronics assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge for OEMs is to quantify safe residue levels and gain insight into how residues impact long-term reliability and functionality of hardware. To compound this problem, the question of “how clean is clean enough” is more challenging as conductors and circuit traces are increasingly narrower.
The objective of this research is to advance the understanding of chemical and electrical effects on reliability of high dense interconnects. Phase 1 of the research focused on designing a new test vehicle to measure electrical responses to high voltage, rate of current change and frequency. Phase 2 studied the effects of high voltage effects on leakage currents in the presence of flux residue and environmental conditions under bottom termination components. Phase 3 will study the effects of frequency on leakage currents in the presence of flux residue and environmental conditions under bottom termination components.
Dr. Mike Bixenman, CTO of Kyzen, has 20 years of experience in the design of electronics assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.