X L5611 is an aqueous blend cleaning chemistry designed for optimum effectiveness on removing flux, solder paste and uncured adhesives from stencils and misprints. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature to provide an economical cleaning solution. LONOX L5611 is compatible with most standard stencil cleaning equipment and can be used in immersion, spray-in-air as well as ultrasonic systems. LONOX L5611 is a biodegradable low VOC aqueous solution. It contains no CFCs or HAPs.
As an aqueous cleaning solution designed with a pH neutral formulation, AQUANOX A4703 is combined with Kyzen’s inhibition technology to provide superior material compatibility. Additionally, A4703 is effective at concentrations as low as 3 percent, while being environmentally friendly and providing the lowest cost of ownership.
This chemistry was developed for use in spray batch and spray in-line cleaning systems to remove OA, no-clean, and RMA pastes and fluxes, including difficult Pb-free residues. A4703 is easily controlled by refractive index, manually or when using an automated process control system such as the Kyzen PCS.
LONOX L5611 and AQUANOX A4703 are RoHS compliant, Halogen, Halide and Hexane free. These formulations have proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. Additionally, the Kyzen Applications Laboratory has evaluated all these formulations for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.