Tensilica’s DPUs helped us pack the LTE functions in a small and power-efficient footprint, and they contributed greatly to the efficient implementation and first-time silicon success of our LTE chip, stated Toshio Miki, Associated Senior Vice President & Managing Director of Communication Device Development Department of NTT DOCOMO. We also achieved a faster time to market and gained post-silicon flexibility due to programmability without sacrificing power or area efficiency.
The DOCOMO project is clearly leading the race to bring LTE technology to the market, and we are delighted to have had the opportunity to contribute to this rapid and successful development, which was demonstrated integrated into an LTE terminal and an LTE datacard at last month’s Mobile World Congress, stated Jack Guedj, Tensilica’s president and CEO. The project proves that our Xtensa DPUs provide both programmability and speed/power efficiency to help designers meet the high performance requirements of LTE wireless modems.
