The unit will function at full power from -10 degrees C to +50 degrees C, and will operate at up to +70 degrees C with derating. The MFA350 is 89% efficient, so only 13CFM airflow is needed for full output power. This has been achieved by the optimisation of proven technology, which includes the use of silicon carbide (SiC) diodes to increase efficiency, lower noise and reduce component count.
High efficiency and ease of thermal management make the power supply ideal for telecommunications equipment, where high power density and compact redundant power systems are a pre-requisite of space-constrained applications. Hot-swap models have oring FET outputs, front access IEC inlets and extraction handles. The MFA350 family is designed with a 1U x 2U profile, allowing vertical or horizontal orientation in standard telecom chassis. A DC input version will also be available.
The units conform to all major international safety and EMC specifications.